Low-cost embedded heterogeneous-component manufacturing process for integrated power electronics

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Title
Low-cost embedded heterogeneous-component manufacturing process for integrated power electronics

CoPED ID
9fa45b3f-0e3d-4260-8ecf-de02afc4bfc4

Status
Closed


Value
£1,425,898

Start Date
Aug. 31, 2017

End Date
Aug. 30, 2019

Description

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We will demonstrate a paradigm shift in the manufacture of electronic power conversion systems by achieving the true potential of wide band-gap switches in applications at power levels from 100s W to 100s kW. Power electronic converters are assembled using a mixture of surface mount technology for low-level electronics & hand/semi-automated assembly of through-hole & larger energy storage & filter components. The assembly processes are slow & the limited range of geometric forms of larger components limits adaption to restricted application geometries & achievable power density. We will create 3D assemblies of power components, sensors & control electronics by embedding these in a PCB laminate allowing power-dense, complete solutions, with complex, 3D internal routing using a single manufacturing process flow. Many individual converters can be made on a single card so the process is suitable for both large & small-volume production & can be reconfigured without re-tooling, so many different products can be accommodated on one production line. Huge reductions in cost over the current state-of-the-art can thus be expected.

Subjects by relevance
  1. Power electronics
  2. Amplifiers
  3. Electronics
  4. Components
  5. Sound reproduction equipment
  6. Electronic components
  7. Manufacturing
  8. Converters (electrical devices)
  9. Electronics assemblers
  10. Power units

Extracted key phrases
  1. Electronic power conversion system
  2. Integrated power electronic
  3. Component manufacturing process
  4. Power component
  5. KW. Power electronic converter
  6. Single manufacturing process flow
  7. Power level
  8. Level electronic
  9. Achievable power density
  10. Amp
  11. Control electronic
  12. Assembly process
  13. Large component
  14. Filter component
  15. Surface mount technology

Related Pages

UKRI project entry

UK Project Locations