Prototype Development and Exploitation of a Microporous Metal based Cold Plate for the advanced Thermal Management of Semiconductors Devices

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Title
Prototype Development and Exploitation of a Microporous Metal based Cold Plate for the advanced Thermal Management of Semiconductors Devices

CoPED ID
be2e21ad-37e6-44d3-96ba-d750edd88a1d

Status
Closed


Value
£148,186

Start Date
March 1, 2012

End Date
Feb. 28, 2013

Description

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Thermal management of computer processing hardware is becoming increasingly important as technology evolves, producing components which test the capabilities of current mainstream forced air computer cooling technologies. Liquid cooling of processing hardware will become commonplace in the near future to enable the continued improved performance of processors. The project will exploit the significant thermal performance advantages of copper foam produced by Lost Carbonate Sintering (LCS) as developed in a previous TSB project; to be used in the real world application of processor cooling utilising liquid cooling technology. The project will produce a low cost, high performance LCS copper foam cold plate prototype for integration into existing liquid cooling loops. To deliver this project effectively Versarien Ltd will work closely with the Porous Metals Group at the University of Liverpool and CTech Innovation to transfer knowledge in order to exploit the potential of LCS copper foam as an effective cold plate material. By benchmarking the heat transfer properties and cooling capabilities of existing cold plates, Versarien Ltd will demonstrate the increased performance potential of LCS copper foam against the current state of the art. Innovation will be required in order to ensure manufacturing consistency in line with required parameters, specifically regarding uniformity of pore geometry and level of porosity of LCS copper foam. Manipulation of the material in order to ensure consistent size, quality and suitability of finish, along with innovative bonding techniques all must be developed; resulting in the production of a high performance cold plate, providing lower cost access to quieter, more efficient liquid cooling systems. Further opportunities for the material and the processes exist in additional applications such as fuel cells, LEDS, power electronics and the nuclear industry

Subjects by relevance
  1. Copper
  2. Refrigeration
  3. Foams
  4. Innovations
  5. Heat transfer
  6. Refrigeration engineering
  7. Processes
  8. Air forces
  9. Metal plate work

Extracted key phrases
  1. High performance LCS copper foam cold plate prototype
  2. Prototype Development
  3. High performance cold plate
  4. Effective cold plate material
  5. Microporous Metal
  6. Cold Plate
  7. Significant thermal performance advantage
  8. Advanced Thermal Management
  9. Computer processing hardware
  10. Performance potential
  11. Liquid cooling
  12. Previous TSB project
  13. Improved performance
  14. Exploitation
  15. Thermal management

Related Pages

UKRI project entry

UK Project Locations