High speed IC Design with novel dielectrics for 5G infrastructure and precision electronics

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Title
High speed IC Design with novel dielectrics for 5G infrastructure and precision electronics

CoPED ID
0ce09e84-e3df-4879-ad6c-4068d19bb7c6

Status
Active

Funders

Value
No funds listed.

Start Date
Aug. 31, 2020

End Date
Feb. 28, 2024

Description

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One of the undisputed trends in the IC industry is the scaling of the fabrication geometries. Besides the clear benefits of lower power consumption, higher speed and higher integration, this trend present new challenges to designers. One of these trade-offs is the usage of back end of line (BEOL) capacitors with low-k dielectrics. The new dielectric allows a higher capacitance per unit area but comes at the cost of increased dielectric absorption and random mismatch. This project will explore in-depth analysis of the capacitor non-idealities limiting the performance of the state of art numerical converters. The main areas of investigation focus on the capacitor mismatch drift and dielectric absorption. Assisted by a group of world leading data converter specialists and academics, you will gather experience in circuit design, layout, characterisation, data analysis and modelling.

Giuseppe Terranova STUDENT_PER

Subjects by relevance
  1. Electrical engineering
  2. Electronics

Extracted key phrases
  1. High speed IC Design
  2. High integration
  3. High capacitance
  4. New dielectric
  5. Dielectric absorption
  6. K dielectric
  7. Low power consumption
  8. Capacitor mismatch drift
  9. IC industry
  10. G infrastructure
  11. Undisputed trend
  12. Precision electronic
  13. Capacitor non
  14. New challenge
  15. Art numerical converter

Related Pages

UKRI project entry

UK Project Locations