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[{"model": "core.projectfund", "pk": 27196, "fields": {"project": 4390, "organisation": 4, "amount": 54593, "start_date": "2014-09-30", "end_date": "2015-08-30", "raw_data": 43141}}]
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{"external_links": []}
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April 11, 2022, 3:47 a.m. |
Created
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[{"model": "core.projectfund", "pk": 19305, "fields": {"project": 4390, "organisation": 4, "amount": 54593, "start_date": "2014-09-30", "end_date": "2015-08-30", "raw_data": 20456}}]
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April 11, 2022, 3:47 a.m. |
Created
41
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[{"model": "core.projectorganisation", "pk": 73532, "fields": {"project": 4390, "organisation": 2173, "role": "PARTICIPANT_ORG"}}]
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April 11, 2022, 3:47 a.m. |
Created
41
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[{"model": "core.projectorganisation", "pk": 73531, "fields": {"project": 4390, "organisation": 2785, "role": "PARTICIPANT_ORG"}}]
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April 11, 2022, 3:47 a.m. |
Created
41
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[{"model": "core.projectorganisation", "pk": 73530, "fields": {"project": 4390, "organisation": 2173, "role": "LEAD_ORG"}}]
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April 11, 2022, 3:47 a.m. |
Created
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[{"model": "core.projectperson", "pk": 45184, "fields": {"project": 4390, "person": 497, "role": "PM_PER"}}]
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April 11, 2022, 1:47 a.m. |
Updated
35
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{"title": ["", "Advanced COB and 3D packaging of Lateral High Voltage IGBTs for compact medical applications - CoLPACK"], "description": ["", "\nWithin the CoLPACK project we will develop an advanced Chip-On-Board (COB) packaging technique suitable for 3D PCB stacking and realisation of more compact size-sensitive electronic products in medical applications, LED lighting and portable consumer electronics. For the first time we will assemble lateral ultra-high voltage (UHV) IGBT dies directly onto the application PCB using flip-chip technique. Proprietary lateral >800V IGBTs with compelling area and switching advantages over competitive solutions have been recently developed by Cambridge Microelectronics. By using a lateral IGBT, where all terminals are on the front side of the die, UHV bondwires (used to contact UHV terminal which is on the back-side of the vertical IGBT die) will be eliminated from the PCB assembly. This is the first time bare UHV devices will be used for flip-chip, COB assembly and 3D PCB stacking.\n\n"], "extra_text": ["", "\n\n\n\n"], "status": ["", "Closed"]}
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April 11, 2022, 1:47 a.m. |
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{"external_links": [16517]}
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April 11, 2022, 1:47 a.m. |
Created
35
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[{"model": "core.project", "pk": 4390, "fields": {"owner": null, "is_locked": false, "coped_id": "0e4b6a5a-e96f-44c7-ad5f-f8a285308edf", "title": "", "description": "", "extra_text": "", "status": "", "start": null, "end": null, "raw_data": 20440, "created": "2022-04-11T01:38:30.544Z", "modified": "2022-04-11T01:38:30.544Z", "external_links": []}}]
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