The advantages brought by Hybrid and Electric Vehicles (HEV/EV) such as being environmentally friendly, less dependent on fossil fuels, cost effective in long term operation etc, HEV/EV has highly focused governments and car manufacturers. Power control is essential in HEV/EV powertrain systems of which the core part is the power IGBT modules. The requirements of modules are strict in electrical and thermal performance, efficiency and reliability. In this project, a power IGBT module incorporating intelligent driver, efficient thermal management concept and advanced packaging technologies for HEV/EV is developed. By combining Dynex Semiconductor's leading expertise in power semiconductors and the University of Nottingham's cutting edge research in enhanced heat transfer and cooling. A new power IGBT module with a flat heat pipe baseplate and intelligent gate driver using advanced bonding and joining technologies such as copper wires, silver sintering and ultrasonic welding will be developed. The module increases heat transfer efficiency by 20% compared with pin fin structures and simplifies cooling system by removing costly, unreliable parts and enhancing efficiency.
