Silicon Carbide Interconnect Optimisation Project
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Silicon Carbide Interconnect Optimisation Project
CoPED ID
87a0e7d7-4380-4c97-8d3f-689e51bd16d9
Status
Closed
Funders
Value
£340,444
Start Date
March 31, 2017
End Date
March 30, 2018
Description
The Silicon Carbide Interconnect Optimisation Project (SCIOP) aims to develop a novel form of die interconnect for the power electronics sector. The project objectives are to explore alternative materials, processes and adhesion technologies which can contribute to improved power module performance and simplified production processes. Improved performance and reduced cost in the enabling technologies of power electronics, due to the pervasive nature of the technology (electric motors, power grids, etc.), has the potential to make a significant contribution in helping the UK exploit semiconductor innovation and in a broader context help move to a low-carbon economy.
| Dzp Technologies Limited | LEAD_ORG |
| Dzp Technologies Limited | PARTICIPANT_ORG |
| Anvil Semiconductors Limited | PARTICIPANT_ORG |
| Zlatka Stoeva | PM_PER |
| Zlatka Stoeva | PM_PER |
Subjects by relevance
- Power electronics
- Technology
- Optimisation
- Electronics
- Semiconductors
- Innovations
- Electric motors
- Information technology
Extracted key phrases
- Silicon Carbide Interconnect Optimisation Project
- Improved power module performance
- Power electronic sector
- Power grid
- Adhesion technology
- Simplified production process
- Broad context help
- Novel form
- SCIOP
- Die interconnect
- Electric motor
- Pervasive nature
- Project objective