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[{"model": "core.projectfund", "pk": 25018, "fields": {"project": 2205, "organisation": 4, "amount": 99985, "start_date": "2014-06-30", "end_date": "2015-09-29", "raw_data": 39370}}]
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[{"model": "core.projectfund", "pk": 17121, "fields": {"project": 2205, "organisation": 4, "amount": 99985, "start_date": "2014-06-30", "end_date": "2015-09-29", "raw_data": 9646}}]
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[{"model": "core.projectorganisation", "pk": 64422, "fields": {"project": 2205, "organisation": 2772, "role": "PARTICIPANT_ORG"}}]
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[{"model": "core.projectorganisation", "pk": 64421, "fields": {"project": 2205, "organisation": 2772, "role": "LEAD_ORG"}}]
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[{"model": "core.projectperson", "pk": 39733, "fields": {"project": 2205, "person": 3117, "role": "PM_PER"}}]
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{"title": ["", "Development of a novel direct metallisation process for Cambridge Nanotherm's nanoceramic-Aluminium substrate in order to create a unique highly thermally efficient substrate material for the global electronics industry"], "description": ["", "\nAlmost 1/5th of global electricity is used for lighting, accounting for c.1.9bn tons of CO2 pa.\nHigh Brightness Light Emitting Diodes (HBLEDs) are globally recognised as a highly\nefficient, long lasting & versatile light source, offering significant promise in the target of\nimproved environmental & economic performance within the future energy demands for\nlighting.\nWhilst technological advancements have improved the efficiency of HBLED lighting\nsystems, currently only 25% of the power utilised is converted into visible light, with the\nremaining 75% generating heat that is dissipated through the substrate on which the LED is\nmounted. Without efficient thermal management, increased temperature within LED chips\nleads to a drop in efficiency, reliability & LED lifespan & is recognized as the main cause of\nfailure.\nCambridge Nanotherm (CNL) has developed & patented a highly innovative nanoceramicaluminium\nsubstrate to addresses the demand for efficient thermal management within\nHBLEDs. Despite the significant breakthroughs that CNL\u2019s substrate has made in the\nreduction of thermal resistance and LED working temperatures, there is scope for much larger\nefficiency gains. These gains are restricted, the cause of which lies in the use of epoxy resin\nadhesive layer used to connect the conductor layer to the nanoceramic substrate.\nThis project seeks to explore the technical feasibility of a direct metallisation process to apply\nthe conductor layer directly to their unique nanoceramic substrate in order to create a highly\nthermally efficient substrate material for the electronics industry. CNL believe the use of\ndirect metallisation will allow them to offer a breakthrough 75% reduction in thermal\nresistance and increase operating temperatures to c.400°C, at a significantly lower cost than\nthe current market offering.\nThe project will prove this process at bench-scale & if successful, pre-production prototyping\n& scale up will ensue with expected market entry in 2016.\n\n"], "extra_text": ["", "\n\n\n\n"], "status": ["", "Closed"]}
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{"external_links": [8083]}
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April 11, 2022, 1:47 a.m. |
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[{"model": "core.project", "pk": 2205, "fields": {"owner": null, "is_locked": false, "coped_id": "d8406903-9f32-4ca5-80d7-7ea69546117b", "title": "", "description": "", "extra_text": "", "status": "", "start": null, "end": null, "raw_data": 9631, "created": "2022-04-11T01:33:27.784Z", "modified": "2022-04-11T01:33:27.784Z", "external_links": []}}]
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