Name
Thermic Edge
CoPED ID
61813b22-0ac1-4aba-b34e-6413251dd91b
About
Projects in CoPED
TESiC-SuperJ - Trench Epitaxy for SiC Superjunctions: technology enabling low loss HVDC power electronics.
Status: Active
Total funding: £797,602
From: Sept. 30, 2021
To: Sept. 29, 2024
Organisations: 10
People: 1
People in CoPED
Addresses
Thermic Edge